HSB18-232310

Name: Same Sky HSB18-232310
Brand: Same Sky
SKU: 490-HSB18-232310
Price: 186 JPY
Availability: InStock

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Mouser #:

490-HSB18-232310

Mfr. #:

HSB18-232310

Mfr.:

Same Sky

Description:

Heat Sinks heat sink, BGA, 23 x 23 x 10 mm

Datasheet:

HSB18-232310 Datasheet (PDF)

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Same Sky
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	Adhesive
Heatsink Material:	Aluminum Alloy
Fin Style:	Vertical Fin
Thermal Resistance:	24 C/W
Length:	23 mm
Width:	23 mm
Height:	10 mm
Type:	Component
Brand:	Same Sky
Color:	Black
Packaging:	Tray
Product Type:	Heat Sinks
Factory Pack Quantity:	150
Subcategory:	Heat Sinks
Unit Weight:	8.500 g

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Compliance Codes

JPHTS:: 854290000
CNHTS:: 8548000090
CAHTS:: 8542900000
USHTS:: 8542900000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

Origin Classifications

Country of Origin:: Taiwan
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Heat Sinks

Same Sky Heat Sinks are are designed to dissipate heat in natural convection and forced air environments. This line of aluminum and copper heat sinks from Same Sky offers a variety of form factors and package types to meet onboard cooling needs. Fin styles include angled, formed, straight, twisted, vertical, extruded axial, and extruded radial. The heat sink lineup also features a variety of mounting styles, such as adhesive, SMT, and through-hole.

BGA Heat Sinks

Same Sky BGA Heat Sinks are ideal for ball grid array (BGA) devices and are measured under four conditions for thermal resistance. These heat sinks carry power dissipation ratings from 1.92W up to 21.74W at +75°C. Made from aluminum or copper with a black anodized or clean finish, the HSB series supports a wide range of sizes, from 8.5mm x 8.5mm to 69.7mm x 69.7mm, with 5mm to 25mm profiles. As adhesive or PCB mountable devices, Same Sky BGA Heat Sinks are essentially simple extrusions where the extruded fins have been crosscut into pins, making them suitable for BGA applications.