開発基板およびキット - x86 Evaluation carrier board for standard SMARC modules based on SMARC Specification 2.1.1

モジュール上コンピュータ - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface

開発ボードとキット - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Core i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).

モジュール上コンピュータ - COM JUMPtec COMe-bKL6 i3-7102E CM238

モジュール上コンピュータ - COM JUMPtec COMe mini Passive Uni Cooler (w/o HSP)

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Core Ultra 7 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores P-cores 1.4Ghz up to 4.8GHz (turbo) E-Cores 0.9GHz up to 3.8GHz (turbo) Low Power E-cores up to 2.5GHz (turbo) Integra

コンピューターケーブル RS232 console adaptor cable

ヒートシンク HSP COMe-mAL10 E2 through

ヒートシンク HSP COMe-mAL10 E2 slim thread

モジュール上コンピュータ - COM COM Express Type 6 Compact module with Intel Core i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

ヒートシンク Standard passive cooling for COM Express Mini Type10 module conga-MA5* Heatstack cooling for modules with standard CPU (open silicone die)* All stand-offs are M2.5 threaded