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3D-MID Component Carriers
HARTING 3D-MID Component Carriers enable alternative component positioning and mounting utilizing fully automated assembly and soldering. These 3D molded interconnect devices can replace circuit boards utilizing a 3-dimensional circuit on molded plastic. This 3D shape can allow for more compact integration of electrical components into the available space. HARTING 3D-MID Component Carriers utilize a high-temperature thermoplastic, enabling compatibility with reflow soldering.
