All Results (1,094)

CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.

Heat Sinks Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.

Computer-On-Modules - COM COM Express Type 6 Compact module based on AMD Ryzen Embedded V2748 8-core processorwith 2.9GHz up to 4.25GHz boost freq., 4MB L2 cache, Radeon Vega Graphics with 7 CU and dualchannel DDR4 3200 MT/s memory interface with ECC support. Commercial tem

Computer-On-Modules - COM COM Express Type 6 Compact module based on AMD Ryzen Embedded V2718 8-core processorwith 1.7GHz up to 4.15GHz boost freq., 4MB L2 cache, Radeon Vega Graphics with 7 CU and dualchannel DDR4 3200 MT/s memory interface with ECC support. Commercial tem

Computer-On-Modules - COM COM HPC Size A module with Intel Core i7-1185G7E Processor, quad core with 2.8GHz (up to 4.4GHz), 12MB L2 cache, GT96 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP).

Computer-On-Modules - COM COM HPC Size A module with Intel Core i3-1115G4E Processor, dual core with 3.0GHz (up to 3.9GHz), 6MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP).

Computer-On-Modules - COM COM HPC Size A module with Intel Core i5-1145GRE Processor, quad core with 2.6GHz (up to 4.1GHz), 8MB L2 cache, GT80 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.

CPU & Chip Coolers Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread.

Heat Sinks Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread.

Computer-On-Modules - COM COM Express Type 6 Basic module based on Intel Core i5-11500HE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset

Computer-On-Modules - COM COM Express Type 6 Basic module based on Intel Celeron Processor 6600HE dual-core processor with 2.6GHz, 8MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset HM570E.