RF Chip Inductors

Fastron RF Chip Inductors feature a ceramic core and are designed for RF applications that require optimal Q on high-frequency circuits. Fastron RF chip inductors feature gold flash pad metallization to provide better solderability for a higher yield in production, and the encapsulation not only protects the winding but also allows surface mount assembly. Case sizes are available in 0402, 0603, 0805, 1008, 1206, and 1210 with an operating temperature range from -40°C to +125°C. Applications include mobile telecommunication, automotive subsystems, and wireless communication.

Types of Inductors, Chokes & Coils

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Results: 5,455
Select Image Part # Mfr. Description Datasheet Availability Pricing (JPY) Filter the results in the table by unit price based on your quantity. Qty. RoHS Inductance Tolerance Maximum DC Current Termination Style Maximum Operating Temperature Qualification
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 15nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

15 nH 5 % 1.15 A SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 16nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

16 nH 5 % 1.1 A SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 17nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

17 nH 5 % 1.1 A SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 18nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

18 nH 5 % 1.1 A SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 19nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

19 nH 5 % 1.1 A SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 20nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

20 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD AEC-Q200 Qualified Non-Stocked Lead-Time 11 Weeks
Min.: 1,000
Mult.: 1,000
: 1,000

20 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 21nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

21 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 22nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

22 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD AEC-Q200 Qualified Non-Stocked Lead-Time 11 Weeks
Min.: 1,000
Mult.: 1,000
: 1,000

22 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 23nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

23 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD AEC-Q200 Qualified Non-Stocked Lead-Time 11 Weeks
Min.: 1,000
Mult.: 1,000
: 1,000

23 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 24nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

24 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD AEC-Q200 Qualified Non-Stocked Lead-Time 11 Weeks
Min.: 1,000
Mult.: 1,000
: 1,000

24 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 25nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

25 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD AEC-Q200 Qualified Non-Stocked Lead-Time 11 Weeks
Min.: 1,000
Mult.: 1,000
: 1,000

25 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 26nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

26 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 27nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

27 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD AEC-Q200 Qualified Non-Stocked Lead-Time 11 Weeks
Min.: 1,000
Mult.: 1,000
: 1,000

27 nH 5 % 800 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 30nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

30 nH 5 % 700 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD AEC-Q200 Qualified Non-Stocked Lead-Time 11 Weeks
Min.: 1,000
Mult.: 1,000
: 1,000

30 nH 5 % 700 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 33nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

33 nH 5 % 650 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD AEC-Q200 Qualified Non-Stocked Lead-Time 11 Weeks
Min.: 1,000
Mult.: 1,000
: 1,000

33 nH 5 % 650 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD Ceramic Core Wire-wound Chip Inductor for RF Applications, Ind 36nH, Tol 5% Non-Stocked Lead-Time 12 Weeks
Min.: 5,000
Mult.: 5,000
: 5,000

36 nH 5 % 600 mA SMD/SMT + 150 C AEC-Q200
Fastron RF Inductors - SMD AEC-Q200 Qualified Non-Stocked Lead-Time 11 Weeks
Min.: 1,000
Mult.: 1,000
: 1,000

36 nH 5 % 600 mA SMD/SMT + 150 C AEC-Q200