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Heat Sinks for TI Audio Evaluation Module
Advanced Thermal Solutions Heat Sinks for TI Audio Evaluation Module are high-performance device-specific heat sinks optimized for natural-convection air cooling. The black anodized finish maximizes heat dissipation. These heat sinks are available with 2 4-40 taped threaded holes. The heat sinks for TI's module come in dimensions of length (A) 50mm to 78mm, width (B) 13mm to 36mm, and height (C) 2mm to 35.6mm.