5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.

Results: 5,817
Select Image Part # Mfr. Description Datasheet Availability Pricing (JPY) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Pitch Number of Rows Termination Style Mounting Angle Stack Height Current Rating Voltage Rating Maximum Data Rate Minimum Operating Temperature Maximum Operating Temperature Contact Plating Contact Material Housing Material Data Rate Series Packaging
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
187Expected 10/5/2026
Min.: 1
Mult.: 1
: 200

Connectors 120 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
100Expected 9/23/2026
Min.: 1
Mult.: 1
: 100

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 56 Gbps SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
150Expected 9/22/2026
Min.: 1
Mult.: 1
: 150

Connectors 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
150On Order
Min.: 1
Mult.: 1
: 75

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 56 Gbps SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
320On Order
Min.: 1
Mult.: 1
: 175

Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
301Expected 9/10/2026
Min.: 1
Mult.: 1
: 175

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
195On Order
Min.: 1
Mult.: 1

Sockets 120 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Board to Board & Mezzanine Connectors 0.635 mm Q Strip High-Speed Ground Plane Socket Strip
465Expected 9/14/2026
Min.: 1
Mult.: 1
: 475

Sockets 100 Position 0.635 mm (0.025 in) 2 Row Solder Straight 1.8 A 285 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSS Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors Q Strip High-Speed Ground Plane Header
300Expected 11/11/2026
Min.: 1
Mult.: 1
: 300
Headers 80 Position 0.8 mm (0.031 in) 2 Row Solder Straight 2 A, 23 A 225 V - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
405On Order
Min.: 1
Mult.: 1

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Straight 5 mm 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
807Expected 10/19/2026
Min.: 1
Mult.: 1

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 5 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) 25 Gbps QTH Tray
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
520Expected 10/29/2026
Min.: 1
Mult.: 1

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 11 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) 25 Gbps QTH Tray
Samtec Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
190Expected 9/29/2026
Min.: 1
Mult.: 1

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 19 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) 25 Gbps QTH Tray
Samtec Board to Board & Mezzanine Connectors 1.27MM SEARAY HS HD ARRAY SCKT
300On Order
Min.: 1
Mult.: 1
: 150

Connectors 560 Position 1.27 mm (0.05 in) 14 Row Solder Straight 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
926On Order
Min.: 1
Mult.: 1
: 475

Sockets 40 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 56 Gbps SEAF Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
374Expected 9/23/2026
Min.: 1
Mult.: 1
: 375

Sockets 300 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 56 Gbps SEAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
150Expected 9/23/2026
Min.: 1
Mult.: 1
: 150

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 56 Gbps SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
450Expected 10/19/2026
Min.: 1
Mult.: 1
: 225

Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 56 Gbps SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
450On Order
Min.: 1
Mult.: 1
: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 56 Gbps SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
92Expected 9/22/2026
Min.: 1
Mult.: 1
: 125

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 56 Gbps SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
221Expected 10/6/2026
Min.: 1
Mult.: 1
: 225

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 56 Gbps SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
290Expected 10/12/2026
Min.: 1
Mult.: 1
: 150

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 56 Gbps SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
150Expected 10/19/2026
Min.: 1
Mult.: 1
: 75

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 56 Gbps SEAM Reel, Cut Tape, MouseReel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
192Expected 11/2/2026
Min.: 1
Mult.: 1
: 175

Headers 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 56 Gbps SEAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
75Expected 10/19/2026
Min.: 1
Mult.: 1
: 75

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 14 mm, 15 mm, 15.5 mm, 16.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 56 Gbps SEAM Reel, Cut Tape