KTM8GL1ASI01

Images are for reference only
See Product Specifications

Mouser #:

473-KTM8GL1ASI01

Mfr. #:

KTM8GL1ASI01

Mfr.:

SMARTsemi

Description:

eMMC FLASH MLC NAND 8GB X1/X4/X8 BUS eMMC 5.1 153-FBGA Industrial

Datasheet:

KTM8GL1ASI01 Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

More Information

Learn more about SMARTsemi KTM8GL1ASI01

Shipping Alert:

Mouser does not presently sell this product in your region.

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	SMART
Product Category:	eMMC
Shipping Restrictions:	Mouser does not presently sell this product in your region.
RoHS:
Series:	KTM
Package / Case:	FBGA-153
Memory Size:	8 GB
Sequential Read:	245 MB/s
Sequential Write:	115 MB/s
Interface Type:	eMMC 5.1
Supply Voltage - Min:	1.7 V
Supply Voltage - Max:	3.6 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Tray
Brand:	SMARTsemi
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Operating Supply Voltage:	1.7 V to 3.6 V
Product Type:	eMMC
Factory Pack Quantity:	152
Subcategory:	Memory & Data Storage
Sustained Read:	245 MB/s
Sustained Write:	115 MB/s

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

KTM8GL1ASI01 Datasheet (PDF)

Compliance Codes

CAHTS:: 8542320040
USHTS:: 8542320051
MXHTS:: 8542320299
ECCN:: 3A991.b.1.a

Origin Classifications

Country of Origin:: Taiwan
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

eMMC 5.1 Memory ICs

SMARTsemi eMMC 5.1 Memory ICs are embedded Flash storage solutions housed in small BGA packages. The ICs are designed for demanding applications and address the need for enhanced reliability. The ICs incorporate onboard error detection and correction, Global wear leveling algorithms, and other data management techniques to provide reliable operation and maximum NAND media life expectancy over the product life cycle.