congatec Thermal Management

Types of Thermal Management

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Results: 238
Select Image Part # Mfr. Description Datasheet Availability Pricing (JPY) Filter the results in the table by unit price based on your quantity. Qty. RoHS
congatec conga-TCR8/CSA-HP-B
congatec CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole. 1In Stock
Min.: 1
Mult.: 1

congatec TCV2/HSP-HP-B
congatec Heat Sinks Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. 2In Stock
Min.: 1
Mult.: 1
JUMPtec CPU & Chip Coolers COMe Active Uni Cooler2 (w/o HSP) 44In Stock
Min.: 1
Mult.: 1

congatec Heat Sinks Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0 129In Stock
Min.: 1
Mult.: 1

congatec Heat Sinks Standard Heat spreader for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole 265In Stock
1On Order
Min.: 1
Mult.: 1
JUMPtec Heat Sinks HSP COMe-mBT10 through 5In Stock
Min.: 1
Mult.: 1
JUMPtec Heat Sinks HSP COMe-mAL10 E2 thread
52On Order
Min.: 1
Mult.: 1

JUMPtec CPU & Chip Coolers HSP COMe-cAP6 Cu-core threaded
25On Order
Min.: 1
Mult.: 1

congatec Heat Sinks Passive cooling for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm
379On Order
Min.: 1
Mult.: 1

congatec CPU & Chip Coolers Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole
10On Order
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-HSP-B
congatec Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.
4Expected 9/10/2026
Min.: 1
Mult.: 1

congatec conga-TC700/CSA-HP-T
congatec CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.
1Expected 11/11/2026
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-CSA-T
congatec CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.
1On Order
Min.: 1
Mult.: 1

congatec Heat Sinks Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded. Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1

congatec Heat Sinks Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded. Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1
congatec CPU & Chip Coolers Passive cooling for Pico ITX module conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded Non-Stocked Lead-Time 7 Weeks
Min.: 1
Mult.: 1
congatec CPU & Chip Coolers Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are M2.5 threaded Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1

JUMPtec Heat Sinks HSP COMe-mEL10 (E2) THREAD Non-Stocked
Min.: 1
Mult.: 1

JUMPtec Heat Sinks HSP COMe-mEL10 (E2) THROUGH Non-Stocked
Min.: 1
Mult.: 1

JUMPtec Heat Sinks HSP COMe-mEL10 (E2) SLIM THREAD Non-Stocked Lead-Time 22 Weeks
Min.: 1
Mult.: 1

JUMPtec Heat Sinks HSP COMe-mEL10 (E2) SLIM THROUGH Non-Stocked
Min.: 1
Mult.: 1

JUMPtec Heat Sinks HSP COMe-cSL6, thread N/A
Min.: 1
Mult.: 1

JUMPtec Heat Sinks HSP COMe-cEL6 (E2) THREAD Non-Stocked
Min.: 1
Mult.: 1

JUMPtec Heat Sinks HSP COMe-cEL6 (E2) THROUGH Non-Stocked
Min.: 1
Mult.: 1

JUMPtec CPU & Chip Coolers HSP COMe-cAP6 Cu-core through Non-Stocked
Min.: 1
Mult.: 1