TE Connectivity AMPMODU Interconnection System
TE Connectivity's (TE) AMPMODU Interconnection System provides connections with a unique modular concept, utilizing precision-formed receptacle contacts and mating posts. Mating of the post and receptacle contacts of this system is very tolerant. This is made possible by a post with a burr-free lead-in and a receptacle contact featuring double cantilever beams and anti-overstress stops.
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TE Connectivity AMPMODU 2mm Wire-to-Board IDC Receptacle Platform
Offers 38% space savings on a PCB as compared to traditional 2.54mm centerline connectors.
TE Connectivity AMPMODU 1.0mm Centerline Interconnect System
Offers an 85% space savings when compared to the standard 2.54mm pitch connectors.
TE Connectivity AMPMODU System 50 Connectors
Features a wide variety of high-density board-to-board and wire-to-board connectors.
TE Connectivity AMPMODU IV & V Connectors
Rugged & reliable wire-to-board interconnections that mate to breakaway headers & shrouded headers.
TE Connectivity AMPMODU MTE Connectors
Available in IDC & crimp termination types, applications include medical instruments & computers.
TE Connectivity AMPMODU System 50/50 Grid
Variety of high-density board-to-board and wire-to-board connectors with a 0.050" x 0.050" pitch.
TE Connectivity AMPMODU MOD II Connectors
0.100" (2.54mm) pitch with shrouded and unshrouded headers in SMT and through-hole configurations.