Wakefield Thermal On-Chip Liquid Cold Plate
Wakefield Thermal On-Chip Liquid Cold Plate supports Intel Xeon® processors and provides direct liquid cooling for high-power server CPUs in AI, high-performance computing (HPC), and hyperscale data center environments. The solution targets Intel Eagle Stream platforms and supports 4th and 5th Gen Intel Xeon Scalable processors, helping manage demanding thermal loads in dense compute racks. This cold plate uses an aluminum body with nickel plating and a vacuum-brazed construction. The design supports CPUs with up to 700W TDP and delivers 0.0267°C/W thermal resistance under the listed test conditions, enabling sustained performance when air cooling may limit rack density. Wakefield Thermal On-Chip Liquid Cold Plate uses Ø10mm OD hose-barb inlet and outlet ports, Intel version 2 EGS fasteners, and 50/50 coolant. The cold plate operates over a recommended temperature range of -40°C to +100 °C.
Features
- Direct on-chip liquid cooling for Intel Eagle Stream platforms
- Support for 4th and 5th Gen Intel Xeon Scalable processors
- Low 0.0267°C/W thermal resistance for sustained processor performance
- Cooling support for high-power CPUs up to 700W TDP
- Higher rack density support for AI and HPC workloads
- Nickel-plated aluminum body with vacuum-brazed construction
- Intel version 2 EGS fastener attachment method
Applications
- AI data centers
- Hyperscale data centers
- High-performance computing workloads
Specifications
- 117.5mm x 77.5mm x 26mm overall size
- Ø10mm OD hose barb inlet and outlet ports
- 700W CPU power test parameter
- +25°C ambient temperature test parameter
- +45°C inlet water temperature test parameter
- 0.6MPa maximum operating pressure
- 1.6LPM flow-rate test parameter
- 50/50 coolant recommended fluid type
- -40°C to +100°C recommended operating temperature range
- 0LPM to 3.5LPM recommended flow-rate range
Thermal Resistance vs. Flowrate
Pressure Drop vs. Flowrate
Related Cold Plates
Wakefield Thermal 131097 Vacuum-Brazed Liquid Cold Plate
Compatible with the industry’s power module devices, such as SiCs, GaNs, IGBTs, and SCRs.
Related Chiller Modules
Wakefield Thermal LCM-600 Liquid Chiller Module
Features a hermetically sealed refrigeration system with a miniature variable-speed compressor.
Wakefield Thermal LCM-900 Liquid Chiller Module
Features 360W maximum power draw at 24VDC and vertical orientation within 30°.
Related Heat Pipes
Wakefield Thermal Heat Pipes
High thermal performance, designed to transfer heat from one area to another or across a material.
Wakefield Thermal Ultra-Thin Heat Pipes
Features a flattened thickness of 1mm or 1.5mm with a 5mm or 6mm diameter and 100mm length.
Related Vapor Chambers
Wakefield Thermal VC Series Vapor Chambers
Used to transport heat to a large area from a small source or a collection of small sources.
Related Intel Xeon® Processors
Intel 第4世代Xeon®スケーラブルプロセッサ
クラウド選択において最も多くの選択肢と柔軟性があり、スムーズなアプリケーション・ポータビリティが備わっています。
Intel 第5世代Xeon®プロセッサ
プロセッサの力を活用してデータを知識に変え、さまざまなタスク全体でワット当たりのパフォーマンスの大幅な向上を実現。