HSB40-252510P

Same Sky
179-HSB40-252510P
HSB40-252510P

Mfr.:

Description:
Heat Sinks heat sink, BGA, 25 x 25 x 10 mm, 2 push pins w/ flange

Datasheet:
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Learn more about Same Sky HSB40-252510P

Product Attribute Attribute Value Select Attribute
Same Sky
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
PCB
Aluminum Alloy
Push Pin
19.5 C/W
25 mm
25 mm
10 mm
BGA Heat Sink
Brand: Same Sky
Packaging: Tray
Product Type: Heat Sinks
Factory Pack Quantity: 70
Subcategory: Heat Sinks
Unit Weight: 15.750 g
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Compliance Codes
JPHTS:
854290000
CNHTS:
8548000090
CAHTS:
8542900000
USHTS:
8542900000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99
Origin Classifications
Country of Origin:
Vietnam
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

BGA Heat Sinks

Same Sky BGA Heat Sinks are ideal for ball grid array (BGA) devices and are measured under four conditions for thermal resistance. These heat sinks carry power dissipation ratings from 1.92W up to 21.74W at +75°C. Made from aluminum or copper with a black anodized or clean finish, the HSB series supports a wide range of sizes, from 8.5mm x 8.5mm to 69.7mm x 69.7mm, with 5mm to 25mm profiles. As adhesive or PCB mountable devices, Same Sky BGA Heat Sinks are essentially simple extrusions where the extruded fins have been crosscut into pins, making them suitable for BGA applications.

In Stock: 197

Stock:
197
Can Ship Immediately
On Order:
5,460
Expected 11/20/2026
Factory Lead-Time:
12
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
¥-
Ext. Price:
¥-
Est. Tariff:

Pricing (JPY)

Qty. Unit Price
Ext. Price
¥428.5 ¥429
¥380.4 ¥3,804
¥362.1 ¥9,053
¥357.1 ¥17,855
¥328.9 ¥23,023
¥315.6 ¥88,368
¥304 ¥170,240
¥294 ¥308,700
¥275.7 ¥694,764

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