AI7931LD

Name: AcSiP AI7931LD
Brand: AcSiP
SKU: 99-AI7931LD
Price: 2159 JPY
Availability: InStock

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Mouser #:

99-AI7931LD

Mfr. #:

AI7931LD

Mfr.:

AcSiP

Description:

Multiprotocol Modules AI7931LD - Multiprotocol Modules WIFI6 Dual Band 2.4/5GHz M33 SoC Module

Datasheet:

AI7931LD Datasheet (PDF)

ECAD Model:

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More Information

Learn more about AcSiP AI7931LD

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	AcSiP
Product Category:	Multiprotocol Modules
RoHS:
Series:	WIFI
Frequency:	300 MHz
Interface Type:	ADC, GPIO, I2C, I2S, IR, PWM, SDIO, SPI, UART
Supply Voltage - Min:	2.97 V
Supply Voltage - Max:	3.63 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Dimensions:	32 mm x 32 mm x 2.7 mm
Protocol - Bluetooth, BLE - 802.15.1:	Bluetooth 5.0
Protocol - WiFi - 802.11:	802.11 a/b/g/n/ac/ax
Packaging:	Bag
Brand:	AcSiP
Core:	ARM Cortex M33
Memory Size:	16 MB
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Number of Channels:	13 Channel
Operating Supply Voltage:	2.97 V to 3.63 V
Product Type:	Multiprotocol Modules
Factory Pack Quantity:	2
Subcategory:	Wireless & RF Modules
Supply Current Receiving:	44 mA, 68 mA
Supply Current Transmitting:	274 mA

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Datasheet

AI7931LD Datasheet (PDF)

Compliance Codes

JPHTS:: 851762090
USHTS:: 8517620090
TARIC:: 8517620000
ECCN:: EAR99

Origin Classifications

Country of Origin:: Taiwan
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

AI7931LD Internet of Things (IoT) Module

AcSiP AI7931LD Internet of Things (IoT) Module is based on Arm^® Cortex^®-M33 with a floating point Microcontroller (MCU) that includes ROM/SRAM memory. This integrated module features a low-power 1x1 802.11a/b/g/n/ac/ax dual-band Wi-Fi^® subsystem, a Power Management Unit (PMU), and a Bluetooth^® v5.0 subsystem. The AI7931LD module supports rich peripherals such as SPI master, I²C, SDIO, IR input, I2S, PWM, GPIOs, and UART. This module is designed for IoT devices with smart connections and cloud applications.