NXP NXP Semiconductors

NXP Semiconductors Thermal enhanced, very-very thin quad flat package, no leads, 24 terminals, step-cut wettable flank, 0.5 mm pitch

NXP Semiconductors Thermal enhanced - flip chip - plastic, quad flat non-lead, 24 terminals, 0.5 mm pitch, 3.5 mm x 4.5 mm x 0.75 mm body

NXP Semiconductors Thermal enhanced - flip chip - plastic, quad flat non-lead, 24 terminals, 0.5 mm pitch, 3.5 mm x 4.5 mm x 0.75 mm body

NXP Semiconductors Thermal enhanced, very-very thin quad flat package, no leads, 24 terminals, step-cut wettable flank, 0.5 mm pitch

NXP Semiconductors Thermal enhanced, very-very thin quad flat package, no leads, 24 terminals, step-cut wettable flank, 0.5 mm pitch

NXP Semiconductors Thermal enhanced, very-very thin quad flat package, no leads, 24 terminals, step-cut wettable flank, 0.5 mm pitch

NXP Semiconductors Thermal enhanced, very-very thin quad flat package, no leads, 24 terminals, step-cut wettable flank, 0.5 mm pitch

NXP Semiconductors Thermal enhanced - flip chip - plastic, quad flat non-lead, 24 terminals, 0.5 mm pitch, 3.5 mm x 4.5 mm x 0.75 mm body

NXP Semiconductors Thermal enhanced - flip chip - plastic, quad flat non-lead, 24 terminals, 0.5 mm pitch, 3.5 mm x 4.5 mm x 0.75 mm body

NXP Semiconductors Thermal enhanced, very-very thin quad flat package, no leads, 24 terminals, step-cut wettable flank, 0.5 mm pitch

NXP Semiconductors Thermal enhanced, very-very thin quad flat package, no leads, 24 terminals, step-cut wettable flank, 0.5 mm pitch

NXP Semiconductors Thermal enhanced, very-very thin quad flat package, no leads, 24 terminals, step-cut wettable flank, 0.5 mm pitch