Microchip Technology 1200V SIC MOSFET

Microchip 1200V SIC MOSFET は、外付けのフリーホイールダイオードを接続する必要がなく、高速で高信頼性の内蔵ボディダイオードによって優れたアバランシェ耐性を実現します。

The TO-247-4 Notch package enables efficient, high-power designs with improved thermal performance and reduced parasitic effects. Its four-lead layout includes a Kelvin source to reduce gate ringing and switching losses, while the Notch design enhances creepage distance for improved high-voltage reliability.

The QDPAK package is a compact, surface-mount, top-side cooled solution designed to maximize the performance advantages of silicon carbide devices in high-power applications. It enables a direct thermal path from the device to an external heatsink, decoupling heat dissipation from the PCB and improving thermal performance, power density, and layout flexibility. The package also reduces parasitic inductance, supports fast switching, and simplifies automated assembly, while its emerging industry‑standard footprint allows scalable, multi-source designs and reduced system complexity.