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560-002-000-210

Name: EDAC 560-002-000-210
Brand: EDAC
SKU: 587-560-002-000-210
Price: 132 JPY
Availability: InStock

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Mouser 番号：

587-560-002-000-210

メーカ番号：

560-002-000-210

メーカ：

EDAC

詳細：

ピン & ソケットコネクタ 560 Series Wire to Wire / Wire to Board 2.5mm pitch connector with 2 contact spaces, female, white, Wire Insulation oe1.00 to oe1.30

データシート:

560-002-000-210 データシート (PDF)

ECADモデル:

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EDAC 560-002-000-210の詳細を読む

在庫: 282

在庫：: 282 すぐに出荷可能

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数量を入力:

最小: 1 倍数: 1

ユニット価格:

¥-

合計額:

¥-

EST関税:

価格 (JPY)

数量	ユニット価格	合計額
	¥132.8	¥133
	¥113.4	¥1,134
	¥106.4	¥2,660
	¥93.8	¥4,690
	¥91	¥9,100
	¥87.5	¥21,875
	¥77.8	¥38,900
	¥70.9	¥70,900

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製品属性	属性値	属性の選択
メーカ:	EDAC
製品カテゴリー:	ピン & ソケットコネクタ
RoHS:
製品:	Receptacle Housings
位置数:	2 Position
行数:	1 Row
間隔:	2.5 mm
末端様式:	Crimp
取り付け様式:	Free Hanging
筐体材質:	Polybutylene Terephthalate (PBT)
定格電圧:	250 V
シリーズ:	560
ブランド:	EDAC
接点タイプ:	Pin, Socket
可燃性等級:	UL 94 V-0
筺体の色:	White
ハウジングの雌雄:	Receptacle
取り付け角度:	Straight
製品タイプ:	Pin & Socket Connectors
工場パックの数量:	500
サブカテゴリ:	Pin & Socket Connectors
単位重量:	800 mg

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選択した属性: 0

ドキュメントの絞り込み:

JPHTS:: 853890000
CNHTS:: 8538900000
CAHTS:: 8536690040
USHTS:: 8538908180
KRHTS:: 8536699000
TARIC:: 8536699099
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

Medical Interconnect Solutions

EDAC offers a comprehensive range of connectors and cable assemblies designed for medical applications. Featured products include card edge connectors for signal and power delivery in blood analyzers, header connectors for facilitating multi-board solutions, in-line connectors for ensuring reliable wire-to-wire and wire-to-board connections, and rugged in-line, D-Sub, USB, and HDMI connectors for IP-rated protection. The IP-rated connectors are EMI-shielded and prevent dust, debris, and moisture ingress, which enhances patient care and diagnostic accuracy while meeting stringent regulatory standards. These EDAC connectors and cable assemblies are ideal medical interconnect solutions, such as ambulances, medical rooms, ventilators, and CPAP machines.

E-Seal Waterproof Connectors

EDAC E-Seal Waterproof Connectors use a unique epoxy sealing process that seals the entire back of the connector rather than at the individual pins. This produces a complete seal with a smooth finish and guarantees no water ingress up to IP67 standards. The E-Seal system offers a full range of D-subs from DB 9 to a maximum of 78 positions. Standard and high-density footprints are available in vertical or right angle orientations. EDAC E-Seal Waterproof Connectors plating options vary from gold flash to 30u” of gold and include a wide variety of mounting options.

Agricultural Technology Interconnect Solutions

EDAC Agricultural Technology (Agritech) Interconnect products offer reliable and durable connector solutions that can withstand harsh agricultural environments, including moisture, dust, and UV radiation exposure. These ruggedized solutions, such as IP67-rated connectors like Inline, D-sub, USB, and HDMI, ensure stable connections for sensor modules and heavy machinery. Increased efficiency, productivity, and yield in agricultural operations are achieved due to this reliability and durability. EDAC Agritech Interconnect Solutions support integrating advanced technologies like IoT and machine learning.

Industrial Interconnect Solutions

EDAC Industrial Interconnect Solutions offer various connectors with robust features for demanding industrial automation environments. Many IP67-rated waterproof connectors provide E-Seal technology for comprehensive back-end sealing and guarding against dust, humidity, and water exposure. EDAC Industrial Interconnect Solutions ensure reliable connection and durability amidst mechanical stresses, environmental challenges, and electrical disturbances. The connectors optimize space utilization in densely packed industrial installations and applications, including manufacturing robotics, pharmaceutical manufacturing, food processing, and conveyor systems.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.