9703-4X10

3M Electronic Specialty
517-9703-4X10
9703-4X10

メーカ:

詳細:
粘着テープ Electrically Conductive Adhesive Transfer Tape 4 in x 10yd Roll

在庫: 17

在庫:
17
すぐに出荷可能
取寄中:
33
予想2026/03/09
工場リードタイム:
8
週間 表示されている時間を超える工場生産予定時間。
最小: 1   倍数: 1
ユニット価格:
¥-
合計 額:
¥-
EST関税:
この製品は配送無料

価格 (JPY)

数量 ユニット価格
合計 額
¥43,657.6 ¥43,658
¥38,419.2 ¥461,030
¥36,726.4 ¥991,613
¥35,776 ¥1,824,576
102 見積り

製品属性 属性値 属性の選択
3M
製品カテゴリー: 粘着テープ
RoHS:  
Tapes
Conductive
Electrically Conductive Adhesive Transfer Tape
Acrylic
4 in
101.6 mm
10 yd
9.14 m
ブランド: 3M Electronic Specialty
製品タイプ: Adhesive Tapes
シリーズ: 9703
工場パックの数量: 3
サブカテゴリ: Supplies
別の部品番号: 7100306861
単位重量: 431 g
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選択した属性: 0

JPHTS:
481141000
CNHTS:
3919109900
USHTS:
4811412100
KRHTS:
4811410000
MXHTS:
4811410100
BRHTS:
48114190
ECCN:
EAR99

9703 Series Electrically Conductive Adhesive Tapes

3M™ 9703 Series 1510-001G-011 Electrically Conductive Adhesive Transfer Tapes feature adhesive-coated liners for a more conformable and flexible double-sided tape. These transfer tapes offer Z-axis-based conductivity in a variety of conductive adhesives, carriers, and fillers to provide enhanced EMI performance. The adhesive transfer tapes electrically connect and mechanically bond medium-pitch flexible circuits with other flexible circuits (flex), rigid printed circuit boards (PCB), or LCD screens. The electrically conductive adhesive transfer tapes are available in multiple thicknesses and provide EMI/RFI shielding and grounding across various frequencies.

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.