9713-4X10

3M Electronic Specialty
517-9713-4X10
9713-4X10

メーカ:

詳細:
粘着テープ XYZ-Axis Electrically Conductive Tape 4 in x 10yds Roll

在庫: 32

在庫:
32 すぐに出荷可能
工場リードタイム:
12 週間 表示されている時間を超える工場生産予定時間。
最小: 1   倍数: 1
ユニット価格:
¥-
合計 額:
¥-
EST関税:
この製品は配送無料

価格 (JPY)

数量 ユニット価格
合計 額
¥19,984 ¥19,984

製品属性 属性値 属性の選択
3M
製品カテゴリー: 粘着テープ
RoHS:  
Tapes
Conductive
XYZ-Axis Electrically Conductive Tape is an Isotropically Conductive Pressure Sensitive Tape
Acrylic
4 in
101.6 mm
10 yd
9.14 m
ブランド: 3M Electronic Specialty
製品タイプ: Tape
シリーズ: 9713
工場パックの数量: 6
サブカテゴリ: Supplies
厚み: 0.0889 mm
別の部品番号: 7000048874
単位重量: 622 g
製品が見つかりました:
類似製品を表示するには、チェックボックスを1つ以上選択します
このカテゴリーの類似製品を表示するには、上記のチェックボックスを1つ以上選択してください。
選択した属性: 0

USHTS:
3506911000
ECCN:
EAR99

Conductive Adhesive 9712 & 9713 Transfer Tape

3M Electronic Specialty Conductive Adhesive 9712 and 9713 Transfer Tape offers XYZ-axis-based conductivity in various conductive adhesives, carriers, and fillers, providing enhanced EMI performance. This tape features an adhesive that is coated directly to the liners for a more conformable and flexible double-sided tape that provides a conductive carbon scrim carrier. The tape is available in multiple thicknesses and offers EMI/RFI shielding and grounding across multiple frequencies. 3M Electronic Specialty 9712 and 9713 series tape is designed for EMI shielding and ground applications, enabling devices to meet electromagnetic compatibility requirements.

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.