すべての結果 (1,141)

CPU & チップクーラ Standard active cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.

CPU & チップクーラ Standard passive cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded.

ヒートシンク Standard heatspreader for high performance COM Express module conga-TC670 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded.

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Core i3-1220PE processor with 4 P-cores 1.5GHz up to 4.2GHz and 4 E-cores 1.1GHz up to 3.1GHz, 12MB Intel Smart Cache, Intel UHD Graphics with 48EUs, Dual channel DDR5 4800 MT/s memory interface, I

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Core i5-1250PE processor with 4 P-cores 1.7GHz up to 4.4GHz and 8 E-cores 1.2GHz up to 3.2GHz, 12MB Intel Smart Cache, Intel Iris Xe Graphics architecture with 80EUs, Dual channel DDR5 4800 MT/s me

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Core i7-1270PE processor with 4 P-cores 1.8GHz up to 4.5GHz and 8 E-cores 1.2GHz up to 3.3GHz, 18MB Intel Smart Cache, Intel Iris Xe Graphics architecture with 96 EUs, Dual channel DDR5 4800 MT/s m

CPU & チップクーラ Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

CPU & チップクーラ Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.

ヒートシンク Standard heatspreader for COM Express Compact modules conga-TC370. * Through hole mounting with bore hole standoffs 2.7mm * Integrated heatpipes* 11mm overall cooling height

モジュールアクセサリ Standard active cooling solution for low and mid range performance COM Express Type 7 module conga-B7XD with integrated copper plate, 70mm 12V radial FAN and 27mm overall heat sink height. Intended for modules with TDP up to 35W * Cu = Copper plate *

ヒートシンク conga-B7XD/HSP-Cu-B

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Core i5-8365UE 4-core processor with 1.6GHz up to 4.1GHz turbo boost, 6MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).