Telink RFおよびワイヤレス

Bluetooth開発ツール - 802.15.1 B91 Development Board applicable to TLSR9218A and TLSR9218B Bluetooth LE 5.2, Bluetooth Mesh, AoA/AoD, 6LoWPAN/Thread, 802.15.4, Zigbee, HomeKit, Find My, Matter, 2.4G Proprietary, RTOS

オンチップRFシステム - SoC BLE 5.0, multi-antenna AoA/AoD, BLE Mesh, 802.15.4, Zigbee 3.0, RF4CE, HomeKit, Dual-Mode, 2.4G Proprietary, 32 pin QFN

Bluetooth開発ツール - 802.15.1 TLSR8258 Audio RCU Starter Kit

オンチップRFシステム - SoC BLE 5.1, multi-antenna AoA/AoD, BLE Mesh, 802.15.4, Zigbee 3.0, RF4CE, HomeKit, Dual-Mode, 2.4G Proprietary, 48 pin QFN

オンチップRFシステム - SoC Multi-protocol Connectivity SoC, 2MB Flash, temp -40? to 105?, 48 Pin Bluetooth LE 5.2, Bluetooth Mesh, AoA/AoD, 6LoWPAN/Thread, 802.15.4, Zigbee, HomeKit, Find My, Matter, 2.4G Proprietary, RTOS PSA Level 1 Certified

Bluetooth開発ツール - 802.15.1 TLSR8278 Audio RCU Starter Kit

オンチップRFシステム - SoC BLE4.2 compliant, BLE5.0 2Mbps and long packet length, 24 pin QFN

オンチップRFシステム - SoC 2.4G Proprietary, 32 pin QFN

オンチップRFシステム - SoC 2.4G 16K OTP, 8K SRAM

マルチプロトコル開発ツール Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this

マルチプロトコルモジュール The ML9118A module is designed based on Telink WiFi 6 multiprotocol SoC, the TLSR9118. It features WiFi 6 + Bluetooth 5.4, tailored for lowpower IoT applications.

Bluetooth開発ツール - 802.15.1 The TL322X EV-board is designed based on the TL322X chip and and is used to verify the TL3228X/3828X series chips and supports various functional tests.