Tflex™ HD7.5 Thermal Gap Filler

Laird Technologies Tflex™ HD7.5 Thermal Gap Filler is a soft silicone material that offers high deflection and 7.5W/mK thermal conductivity. The HD7.5 series is designed to provide superior pressure vs. deflection characteristics. The material offers minimal stress on components during application while maintaining low thermal resistance. Additional features include low outgassing and oil bleeding, 3.4g/cc density, and -40°C to +150°C temperature range. Laird Technologies Tflex HD7.5 Thermal Gap Filler is available in 18" x 18" and 9" x 9" standard sheet sizes with thicknesses ranging from 1mm to 5mm in 0.25mm increments.