すべての結果 (1,095)

モジュール上コンピュータ - COM COM-HPC Mini module based on Intel Core i7-1365URE processor with 2 P-cores 1.7GHz up to 4.9GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo 12MB Intel Smart Cache Intel Iris Xe Graphics architecture with 96 EUs 32GB onboard LPDDR5x memor

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Core i7-1365UE

モジュール上コンピュータ - COM JUMPtec COMe-bBD7R E2 D-1539 10G-KR

モジュール上コンピュータ - COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

開発ボードとキット - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)

モジュール上コンピュータ - COM JUMPtec COMe mini Active Uni Cooler (w/o HSP)

モジュール上コンピュータ - COM JUMPtec COMe-bKL6 i3-7102E CM238

開発基板およびキット - x86 COMe Eval Carrier T7

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Core i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).

ヒートシンク HSP COMe-mAL10 E2 slim thread

ヒートシンク Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm

CPU & チップクーラ Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.