Laird Technologies
Laird Performance Materialsは、EMI抑制、熱管理材料、構造・精密金属、複合機能製品など、電子機器保護ソリューションの設計・開発を行っています。材料科学の専門家により、保護性能の向上、性能と信頼性の強化、カスタム構造設計、開発期間の短縮を実現します。
の注目製品 Laird Technologies
MAF06 High-Current Low DCR SMD Power Inductors
Power line noise suppression and desired power efficiency while delivering extremely low DCR.
Tflex™ HR6.5 Thermal Gap Filler
Thermal interface material with >6W/mK thermal conductivity with high recovery properties.
Tflex™ CR550 2-Part Dispensable Gap Filler
Transfers unwanted heat in automotive components and the A+B putty material cures in place.
Tputty™ 910 1-Part Dispensable Gap Filler
Minimizes stress on components during assembly, offers the reliability of a traditional thermal pad.