Advanced Thermal Solutions Heat Sinks
Advanced Thermal Solutions Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW™, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.
The maxiFLOW series heat sinks feature several attachment methods: maxiGRIP™, superGRIP™, thermal tape, and push pin. The maxiGRIP attachment applies steady, even pressure to the component and does not require holes in the PCB. The superGRIP attachment needs only minimal space around the component perimeter, making it ideal for densely populated PCBs. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.
ATS Heat Sinks are well suited to meet the thermal requirements of a broad range of electronics packages such as ball grid array (BGA), quad flat package (QFP), lead chip carrier (LCC), land grid array (LGA), ceramic leaded chip carrier (CLCC), thin small outline package (TSOP), dual inline package (DIP), and low-profile quad flat package (LQFP).
Features
- Fabricated from anodized extruded aluminum for maximum thermal performance
- Low-profile spread fin array
- High thermal performance through convection cooling
- Designed for standard height components from 3mm to 4.5mm
- Lineup includes maxiGRIP and superGRIP heat sink attachments, thermal tape, and push pins
Applications
- Low-profile component cooling
- Compatible with a broad range of electronic packages: BGA, QFP, LCC, LGA, CLCC, TSOP, DIP, and LQFP
Videos
Featured Heat Sinks
Advanced Thermal Solutions maxiFLOW™ Power Brick Heat Sinks
Specially designed to cool eighth-, quarter-, half-, and full-brick size DC-to-DC converters
Advanced Thermal Solutions High-Performance Linear LED Heat Sinks
Features the patented maxiFLOW™ design, reducing temperatures by 50%.
Advanced Thermal Solutions BGA High-Performance Heat Sinks for NXP
Designed for NXP MPC flip-chip processors
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