Octavo Systems OSDZU3 AMD-Xilinx Zynq UltraScale+ ZU3 SiPs

Octavo Systems OSDZU3 AMD-Xilinx Zynq UltraScale+ ZU3 System-in-Packages (SiPs) are a fast, flexible way to develop a system around the AMD Xilinx^® Zynq^® UltraScale+™ MPSoC. These SiPs allow users to harness the performance of the ZU3 MPSoC while removing the complexities without sacrificing flexibility. The OSZU3 SiPs integrate the AMD-Xilinx ZU3 Zynq UltraScale+ MPSoC, with 2GB (16GB) LPDDR4, power management, and other required components into a single BGA package. This integration reduces design effort by months, allowing users to get to market faster or spend time adding more features to products.

The OSDZU3 SiPs provide access to all the interfaces and features on the ZU3. The 1mm pitch 600-pin ball map provides access to every I/O on the ZU3 in just two PCB layers using low-cost design rules. The power system also allows the designer to leverage all the power modes the ZU3 supports. The OSDZU3 SiPs are compatible with the AMD-Xilinx development tools, Xilinx Vivado Design Suite, and Xilinx Vitis unified software platform.

Features

Integrated into the OSDZU3 SiP are an AMD ZU3 device, two IRPS5401s, up to 16GB (2GB) LPDDR4, up to 1GB (128MB) QSPI Flash, EEPROM, two oscillators, and passive components
ZU3:
- Quad-core Arm^® Cortex^®-A-53 processors up to 1.5GHz
- Dual-core Arm^® Cortex^®-R5 based Real-time Processing Unit (RPU) up to 600MHz
- Programmable Logic (PL) array with 154,350 system logic cells, 141,120 CLB flip-flops, 70,560 CLB LUTs, and 360 DSP slices
- 2Mb on-chip RAM (OCM) in the PS with ECC
- 7.6Mb on-chip RAM (block RAM) with ECC (PL)
- 1.8Mb on-chip RAM (distributed RAM) (PL)
Access to all I/O signals of the ZU3 SFVC784 (784 pin) package

LPDDR4
Compatible with ZU3 development tools and software
QSPI Flash
33.333MHz oscillator
32.768kHz crystal oscillator
4.5V to 5.5V single input voltage range
4 system usable power outputs
20.5mm x 40mm dimensions

Applications

CG devices
- Sensor processing and fusion
- Motor control
- Low-cost ultrasound
- Traffic engineering
EG devices
- Flight navigation
- Missile and munitions
- Military construction
- Secure solutions
- Networking
- Cloud computing security
- Data centers
- Machine vision
- Medical endoscopy

EV devices
- Situational awareness
- Surveillance/reconnaissance
- Smart vision
- Image manipulation
- Graphic overlay
- Human-machine interfaces
- Automotive ADAS
- Video processing
- Interactive displays