Laird Technologies GOF3000 Thermal & EMI Gaskets
Laird Technologies GOF3000 Thermal and EMI Gaskets offer electrical conductivity for EMI grounding and a silicone foam core. These gaskets provide thermal transfer performance in the form of a traditionally wrapped compressible foam gasket and have an additional outside layer for electrical conductivity. The GOF3000 series simplifies system designs with economical system space usage through a multifunctional component. Laird Technologies GOF3000 Gaskets combine the thermal transfer performance of Laird's Tgon™ 9000 synthetic graphite, copper's electrical conductivity, and the repeatable compression and rebound of the foam core.Features
- Efficient thermal transfer over large gaps
- Electrical conductivity for EMI grounding
- High deflection and low force
- Repeatable compression and rebound cycles
- No bleed from silicone oil or other materials
- Lightweight
- Abrasion-resistant exterior
- Ease of manufacturing for high volume
Applications
- EMI shielding
- Large component gaps
- Optical modules
- Sliding connections
- Thermal transfer
- Automated packaging
Specifications
- Silicone foam core
- UL 94V-0 flammability rating
- ±0.3mm to ±1mm thickness tolerance range
- ±0.5mm width tolerance
- 3mm to 25mm width range
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公開: 2021-06-28
| 更新済み: 2025-06-17
