Laird Technologies Tflex™ SF10 Thermal Gap Filler
Laird Technologies Tflex™ SF10 Thermal Gap Filler offers 10W/mK thermal conductivity, 0.5mm to 4mm thickness range, and 3.7g/cc density. This filler features silicone-free material with excellent deflection properties, providing minimal pressure on components during deflection. Laird Tflex SF10 Thermal Gap Filler is an environmentally friendly solution that meets regulatory requirements, including RoHS and REACH.
Features
- Silicone-free formulation
- High thermal performance (10W/mK)
- Low shore hardness
- Low pressure versus deflection
- Low relaxation pressure, minimizes board and component stress
- Surface wetting for low contact resistance
- Low thermal resistance
- No fiberglass reinforcement
- Minimal oil bleed
- RoHS and REACH compliant
Specifications
- 0.5mm to 4mm (0.020” to 0.160”) thickness range in 0.25mm (0.010”) increments
- 9” x 9” or 18” x 18” sheet sizes
- -40°C to +125°C operating temperature range
Videos
Pressure vs Deflection
Thermal Resistance vs Pressure
Additional Resources
Related Gap Fillers
Laird Technologies Tflex™ HD7.5 Thermal Gap Filler
Soft silicone material that offers high deflection and 7.5W/mK thermal conductivity.
Laird Technologies Tflex™ RB300 Thermal Gap Filler
Exceptionally soft gap filler pads with a thermal conductivity of 1.2 W/mK.
公開: 2021-02-08
| 更新済み: 2025-06-17