Laird Technologies Tflex™ SF800 Thermal Gap Filler
Laird Technologies Tflex™ SF800 Thermal Gap Filler is a high-performance, silicone-free, thermally conductive gap pad. This series combines high thermal conductivity with exceptional wetting characteristics to provide low thermal resistance. Laird Technologies Tflex SF800 Thermal Gap Filler is RoHS and REACH compliant. The SF800 series is ideally used in applications where silicone-based pads are traditionally used and in silicone-sensitive applications.
Features
- Silicone-free gap filler
- 7.8W/mK thermal conductivity
- 3.21g/cc density
- -25°C to +120°C operating temperature range
- Low thermal resistance
- Standard thickness
- 0.5mm to 4mm thick material
- 0.25mm increments
- Standard sheet sizes of 9" x 9"
- RoHS and REACH compliant
Applications
- Automotive
- Silicone-sensitive
- Optical components
- Medical devices
- Aerospace electronics
Performance Graphs
Related Gap Fillers
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公開: 2020-06-17
| 更新済み: 2025-06-19