Laird Technologies Tgon™ 805 Series Thermal Interface Pads
Laird Technologies Tgon™ 805 Series Thermal Interface Pads feature a grain-oriented and plate-like structure that provides a high thermal conductivity. These interface pads include high thermal conductivity of 5W/mK on the Z-axis and 240W/mK on the X-Y-axis. The Tgon 805 series has proprietary pressure-sensitive adhesive on one side that minimizes impact on thermal performance. These interface pads offer >98% graphite, low thermal resistance, and high performance. Laird Technologies Tgon 805 pads are ideal for power conversion equipment, power supplies, large telecommunications switching hardware, and notebook computers.
Features
- High thermal conductivity of 5W/mK on the Z-axis and 240W/mK on the X-Y axis
- >98% graphite
- -240°C to +300°C operating temperature range
- Low thermal resistance
- Thicknesses of 0.005”, 0.010”, and 0.020” (0.125mm, 0.25mm, and 0.50mm)
Applications
- Power conversion equipment
- Power supplies
- Large telecommunications switching hardware
- Notebook computers
- Where electrical grounding is required with good thermal conductivity
Related Solutions
Laird Technologies Thermal Interface Solutions
Designed to meet the challenges of today's electronics, which are smaller but more powerful.
公開: 2020-10-21
| 更新済み: 2025-06-17