Laird Technologies Tputty™ 607MF 1-Part Dispensable Gap Filler
Laird Technologies Tputty™ 607MF 1-Part Dispensable Gap Filler is highly thermally conductive and specially designed in response to the growing need for high-speed assembly. This single-part dispensable gap filler offers a 105g/min flow rate ideal for assembly operations, while the soft material is easily reworkable and RoHS and REACH compliant. With high reliability and 6.2W/mK thermal conductivity, the Tputty 607MF series from Laird is suitable for a variety of applications, including microprocessors, graphic chips, high-power automotive electronic controls, and telecom base stations.Features
- 6.2W/m·K thermal conductivity
- High flow rate and good tackiness
- Easily reworkable
- Demonstrated thermal cycling stability
- 105g/min flow rate
- Meets RoHS and REACH requirements
Applications
- Telecom base stations
- Graphic chips
- Microprocessors
- High-power automotive electronic controls
Resources
公開: 2025-07-23
| 更新済み: 2025-09-15
