Laird Technologies Tputty™ 607MF 1-Part Dispensable Gap Filler

Laird Technologies Tputty™ 607MF 1-Part Dispensable Gap Filler is highly thermally conductive and specially designed in response to the growing need for high-speed assembly. This single-part dispensable gap filler offers a 105g/min flow rate ideal for assembly operations, while the soft material is easily reworkable and RoHS and REACH compliant. With high reliability and 6.2W/mK thermal conductivity, the Tputty 607MF series from Laird is suitable for a variety of applications, including microprocessors, graphic chips, high-power automotive electronic controls, and telecom base stations.

Features

  • 6.2W/m·K thermal conductivity
  • High flow rate and good tackiness
  • Easily reworkable
  • Demonstrated thermal cycling stability
  • 105g/min flow rate
  • Meets RoHS and REACH requirements

Applications

  • Telecom base stations
  • Graphic chips
  • Microprocessors
  • High-power automotive electronic controls
公開: 2025-07-23 | 更新済み: 2025-09-15