Masach Tech Tin-Steel Drawn-Seamless EMI/RFI Shields

Masach Tech Tin-Steel Drawn-Seamless Electromagnetic Interference / Radio Frequency Interference (EMI / RFI) Shields feature a thin resultant layer of tin that enables easy solderability to PC boards while resisting corrosion during assembly. Masach's fabrication process uses drawn frames and snap-on covers to produce a seamless, more hermetic shield that is as durable as it is effective. The convenient two-piece design enables the inspection and repair of shielded components without removing the entire shield. These EMI / RFI shields are fabricated using materials based on mild steel with less than 0.12% carbon and no more than 1% alloying elements and naturally occurring impurities. The major shielding elements are ferrous and tin. Masach Tech Tin-Steel Drawn-Seamless EMI / RFI Shields are ideal for virtually any surface-mount application.

Features

Seamless protective cage for higher shielding effectiveness
Optimal planarity for higher yield on reflow soldering
Commonly used for board-level shielding due to exceptional mechanical formability, environmental compliance, and cost-effective design
Solid construction resists dents and warps

Highly reliable 2-piece design (frame and cover) accommodates virtually any surface-mount application
2-piece design enables repair to components without removing shield, saving time and reducing repair damage
Thin resultant layer of tin enables easy solderability to PC boards while resisting corrosion during assembly

Applications

Telecom
Medical
Avionics
Automotive

Industrial
Energy
Lighting
Agriculture

Specifications

Cold reduced electrolytic tinplate steel / TS 275E8.4/8.4 EN 10202:2001
Major shielding elements are ferrous and tin
Single or 2-piece configurations available

Materials used to fabricate components based on mild steel with less than 0.12% carbon and no more than 1% alloying elements and naturally occurring impurities