NexCOBOT ICES675S Computer-On-Module (COM)
NexCOBOT ICES675S Computer-On-Modules (COM) is a COM Express Type 6-pinout basic module that supports Intel® 8/9th generation Intel Core™ processors. This device features an Intel C240 series PCH chipset, socket 1511, DDR4 with ECC or non-ECC SO-DIMM 2666MHZ up to 32GB. The ICES675S COM integrated Intel HD graphics engines expand via PCI Express graphic 1 x 16 lanes and support three Digital Display Interfaces (DDI). This module supports 1 x GBE LAN, 4 x USB 3.1 GEN1, 8 x USB 2.0, 4 x SATA 3.0, 2 x UART(TX/RX), HD audio, 8-bit DIO, and TPM (optional) ICEB 8060. The ICES675S COM operates at 0°C to 60°C temperature range and meets CE/FCC Class B certifications.Features
- 8/9th generation Intel® Core™ processors, socket 1511, and PCH C246
- 2 channel DDR4 with ECC or non-ECC SO-DIMM 2666MHz up to 32GB
- Support triple display VGA, 2 x DP, and eDP/LVDS 24-bit dual channel
- PCI express lane x16 (configurable: “1 x16” ; “2 x8” ; “1 x8 + 2 x4”)
- PCI express lane x1 (Gen 3) and 8x (can be configured x1 and x4)
- IO: 2 x UART (RX/TX), 8-bit DIO, WDT, and TPM (optional)
Specifications
- CPU support:
- 8/9th Intel® (Coffee Lake-S) Xeon® and Core™ i7/ i5 /i3 processor and LGA1151 socket, and TDP max 65W
- CPU support list:
- 35W: Xeon E-2278GEL (8C) (with ECC)
- 65W: i7-8700 (6c)/i5-8500 (6c)/i3-8100 (4c) (with ECC)
- 35W: i7-8700T (6c)/i5-8500T (6c)/i3-8100T (4c) (with ECC)
- 35W: i7-9700TE (8c)/i5-9500TE (6c)/i3-9100TE (4c) (with ECC)
- PCH C246
- Dual channel DDR 4 SO-DIMM memory socket with non-ECC support, up to 32GB 2666MHz, ECC support as an option with Intel i3-8100, i3-8100T, and i3-9100TE
- Display:
- Integrated Intel Gen9 graphics graphic engine
- 1 x VGA connector (resolution up to 1920 x 1080 @ 60Hz)
- 1 x LVDS connector (resolution up to 1920 x 1080 @ 60Hz)
- DDI 1/2 port configurable to HDMI 1.4/DVI/Display port 1.4 HDMI up to 4096 x 2160 @ 30Hz/24bpp, DVI up to 1920 x 1200 @ 60Hz, and DP up to 4096 x 2304 @ 60Hz
- AMI (UEFI) BIOS
- COM Express connector:
- AB: LVDS: (LVDS/eDP co-lay), VGA: (VGA/DDI port3 co-lay), 1 x GbE LAN, 6 x PCIex1, HD audio, 4 x SATA III, 8 x USB 2.0, LPC Bus, SM Bus/I2C, 2 x COM, and GPIO 8-bit
- CD: DDI1, DDI2, 1 x PCIe x16, 2 x PCIe x1, and 4 x USB 3.0
- Power requirement:
- +12VDC and +5Vsb
- Support both AT and ATX power supply mode
- 125mm x 95mm dimensions
- 0°C to 60°C board-level operation temperature range
- Relative humidity:
- 10% to 95% (operating, non-condensing)
- 5% to 95% (non-operating, non-condensing)
- Meet CE/FCC Class B certifications
Block Diagram
Module Overview
公開: 2024-10-07
| 更新済み: 2024-10-21
