Octavo Systems OSD335x-SM Family of System-In-Package Devices

Octavo Systems OSD335x-SM System-in-Package (SiP) is a small Arm Cortex®-A8 Texas Instruments Sitara-based module.  It integrates a TI AM335x processor running up to 1GHz with up to 1GB of DDR3 memory, 2 power supplies, EEPROM, and over 100 passives components.  All of this is backed into a single easy-to-use 21mm X 21mm BGA that is smaller than an equivalent discrete system.

This integration also speeds up the design cycle and removes the need for complicated DDR Routing and power sequencing.  The OSD335x-SM is the easiest way to develop compact Embedded Linux, Android or RTOS systems.

Available in both commercial and industrial temperature ranges, the OSD335x-SM devices are well suited for a variety of environments

Features

  • Power In:
    • AC adapter, USB, or single cell (1S) Li-Ion/Li-Po battery
  • Power Out:
    • 1.8V, 3.3V, and SYS (switched VIN)
  • 1.8V or 3.3V selectable AM335x I/O voltage
  • Benefits:
    • Integrates over 100 components into one package
    • 60% reduction in board space vs discrete implementation
    • Compatible with AM335x development tools and software
    • Wide BGA ball pitch allows for low-cost assembly
    • Significantly reduces design time
    • Decreases layout complexity
    • Increased reliability through the reduced number of components
  • Package Info:
    • 21mm x 21mm BGA
    • 256 balls (16 x 16 grid) with 1.27mm pitch 
    • 0°C to 85°C and -40°C to 85°C case operating temperature range

Operating Temperature Range Indication

Octavo Systems OSD335x-SM Family of System-In-Package Devices

OSD335x-SM Industrial Rated SiP Detailed Block Diagram

Block Diagram - Octavo Systems OSD335x-SM Family of System-In-Package Devices
公開: 2018-03-21 | 更新済み: 2022-09-27