新しい熱インターフェイス製品
StarTech High-Performance Silicone Thermal Paste is designed for efficient heat transfer and safe application in various environments. This paste is a silicone-based thermal compound with a thermal conductivity of 14.5W/m-K and a wide operating temperature range of -50°C to +280°C, maintaining thermal stability in CPUs, GPUs, and ICs with high TDP under continuous load. StarTech High-Performance Silicone Thermal Paste includes a resealable 10g syringe with screw cap and plunger, enabling controlled, repeatable use in upgrades, repairs, or custom builds. By utilizing electrically non-conductive grease, damaging shorts are prevented, supporting safe use in space-constrained or critical system builds.
-
StarTech High-Performance Silicone Thermal PasteDesigned for efficient heat transfer and safe application in various environments.2026/04/08
-
Bourns BTJ サーマルジャンパーチップ高い熱伝導性を提供すると同時に絶縁性も備えた、放熱用のユニークな表面実装部品。2026/02/02 -
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.2025/11/06 -
Laird Technologies Tflex™ HR6.5 Thermal Gap FillerThermal interface material with >6W/mK thermal conductivity with high recovery properties.2025/09/15 -
Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap FillersProvide high thermal conductivity, low thermal resistance, and high reliability.2025/09/09 -
Laird Technologies Tputty™ SF560 1-Part Dispensable Gap FillersDesigned to offer thermal conductivity of 5.6W/mK, along with superior thermal resistance.2025/08/25 -
Wakefield Thermal ulTIMiFlux Dielectric Phase Change TIMThermally conductive electrical insulators for semiconductor-to-heat sink interfaces2025/07/23 -
Laird Technologies Tflex™ CR550 2-Part Dispensable Gap FillerTransfers unwanted heat in automotive components and the A+B putty material cures in place.2024/10/25 -
Laird Technologies Tflex SF4 Thermal Gap FillersSilicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.2024/09/10 -
Laird Technologies Tflex SF7 Thermal Gap FillersInnovative, high-performing thermal material with silicone-free construction.2024/09/10 -
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap FillerSilicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.2024/05/30 -
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.2024/05/27 -
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip ResistorsFeatures chip sizes ranging from 0603 to 2512.2024/01/18 -
MG Chemicals Non-Silicone Liquid Thermal Gel1-part gel that offers extreme thermal conductivity and flame retardancy.2023/10/30 -
LeaderTech TCF超薄型カーボンファイバ熱パッド低熱抵抗、ソフト表面で、主に熱伝導性フィラーとしてカーボンファイバを使用しています。2023/10/18 -
LeaderTech TGN超薄型サーマルパッド低熱抵抗が特徴で、グラフェンとシリコンを組み合わせて製造されています。2023/10/18 -
LeaderTech TCIインジウム化合物シート溶融点で固体から液体へと変わり、室温で再び固体に戻ります。2023/10/18 -
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal GreaseFeature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.2023/09/27 -
Laird Technologies CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.2023/09/08 -
Bergquist Company データセンタ・アプリケーション先端素材は、熱管理、長期信頼性、ストレス保護に役立ちます。2023/04/01 -
Laird Technologies Tpcm™ 7000 High-Performance TIMsDesigned to enhance the cooling of the thermal challenges in electronics.2022/08/03 -
Laird Technologies Tflex™ HD7.5 Thermal Gap FillerSoft silicone material that offers high deflection and 7.5W/mK thermal conductivity.2022/08/03 -
Laird Technologies Tpcm™ 5000 High-Performance TIMFeatures low thermal resistance and a non-silicone formulation with a naturally tacky surface.2022/07/19 -
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal GelAssures high thermal conductivity, good dispensing efficiency, and high thermal reliability.2022/07/11 -
Laird Technologies Ttape™ 1000A Thermally Conductive TapePressure-sensitive adhesive with low thermal resistance, only needs finger pressure for application.2022/06/03